LOCATION

Located in the Greater Toronto Area. Within in one hour of the U.S. border and less than ½  hour from the Pearson International Airport. Close to all major forms transportation.

FACILITY

• 10,000 sq. ft. (14' ceiling) air conditioned Facility
• 900 sq. ft. office (10% office, 90% production)

FUTURE EQUIPMENT/CAPABILITIES

• Lead-free SMT, hand soldering, and if warranted wave solder.
• ROHS and Lead free all employee training - program and process in development, monthly status and targets set for completion Dec 05'
• Automated Optical Inspection for solder paste, pre-solder inspection, and after solder inspection.

EQUIPMENT & CAPABILITIES

• Surface Mount Technology
• Paste printing; 1 Vision assisted SMT printer, 2 semi-auto printers; One manual paste printing fixture
• Placement: 2 high speed high flexible placers - Laser align touch less centering, rated 4800 components per hour CPH, down to 0402
• 2 medium speed flex placers - mechanical centering, handles down to 0603
• Feeders, same all machines: 150+ SMT tape feeders, 100+ IC lane feeders, 10 Waffle tray handlers.
•  2 Semi-automatic placement station for prototyping or parts which cannot be machine handled
• 1 Glue dispensing machine
• Re-flow: 2 identical convection dominant (with IR additional) re-flow ovens
• Special placement: SRT-FPDW precision automated rework/soldering and placement station - 128 ball BGA capable
• Wave solder: 10" wave solder machine with spray fluxer, feedback control on conveyor speed, pre-heat. No-clean or water soluble process
• Wash: PCB batch washer with closed loop de-ionized water treatment and monitoring apparatus
• Mass Lead trimming
• 2 Vision Engineering Dynascope zoom microscopes
•  Through whole manual stuffing line(s) flexible set-up, more than 75' of bench space can be utilized for this purpose.